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SL - Models of Bonding & Structure

25 MCQ from 2025 Question Bank Models of Bonding & Structure (all topics)

DP IB SL Chemistry Quiz

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1. Which statement best describes the properties of an alloy?

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2. Which of the following has covalent bonding?

  • I. CCl4
    II. Ca3N2
    III. NH3

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3. The respective names of the monomer and polymer in the below polymerization reaction are:

10.2-147

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4. The structures of diamond and buckminsterfullerene are shown.

CH0702

Which of the following correctly describes the physical properties of the two materials?

  • Electrically conductive materials Hard materials
    A. Neither Both
    B. Neither Diamond only
    C. Buckminsterfullerene only Both
    D. Buckminsterfullerene only Diamond only

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5. What is the formula of the compound formed between lithium and nitrogen?

 

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6. The reaction of solid magnesium with gaseous oxygen is shown.

Mg(s)+1/2O2(g)→MgO(s)

Which of the following correctly describes the process of MgO(s) formation?

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7. Which of the following polyatomic ions formulas is incorrect?

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8. Which statements are correct about lattice enthalpies?

  • I. Salts with smaller lattice enthalpies have higher melting points
    II. The lattice enthalpy depends on the charge of the constituent ions
    III. The lattice enthalpy depends on the size of the constituent ions

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9. In which instance is ionic bonding most likely to occur?

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10. CH3​COOH has which of the following intermolecular forces?
I. London
II. Dipole-Dipole
III. Hydrogen bonds

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11. Which of the following cannot conduct electricity in a molten state?

I. PCl3​
II. NaCl
III. SO2

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12. Carbon tetrachloride has covalent bonding. Which of the following clearly describes this type of bonding?

 

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13. Which of the following statements regarding silicon dioxide, SiO, are correct?

  • I.The structure is described as a giant covalent structure with a tetrahedral arrangement
    II.The structure is insoluble in water and has a high melting point
    III.The structure has a pair of nonbonding electrons present on the silicon atoms

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14. Which of the following is NOT true of metals?

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15. The structural formulas of two compounds in a homologous series are shown.

CH0788

Why does the boiling point of compound Y differ from that of compound X?

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16. Which of the following polyatomic ions formulas is incorrect?

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17. Metallic bonding is best characterized by the following statement:

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18. What properties would be characteristic of a material with an electronegativity difference of 2.2 and an average electronegativity equal to 1.8?

Refer to Section 17 of the data booklet.

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19. Which statement explains the high boiling point of NH3?

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20. Which properties are typical of ionic compounds?

  • Volatility Solubility in polar solvents
    A. High Good
    B. Low Good
    C. High Poor
    D. Low Poor

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21. The Lewis structure of NCl3 is given below. Which type(s) of electrons does it show?

4.2-0287

I. Non-Bonding Electrons
II. Bonding Electrons
III. Innermost electrons

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22. Which correctly states the relative size of the bond angles for H2O, NH, and CH4?

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23. Which of the following statements regarding the Lewis structure of BF3 is correct?

I. The structure contains a net dipole moment
II. The structure would have bond angles of 120 with one double bond
III. The structure is considered to be electron deficient

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24. Which of the following substances is the most soluble in water, with the correct reason given?

  • Substance Reason
    A. PF3 The bonds are very polar
    B. PF3 The molecule has a permanent dipole
    C. NH3 It can form hydrogen bonds with itself
    D. NH3 It can form hydrogen bonds with water molecules

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25. Which is a correct description of the bonding present in the following allotropes of carbon?

  • Graphene Diamond Graphite
    A. 3-dimensional material with bond angles of 109.5 2-dimensional material with bond angles of 120 Hexagonal layers with bond angles of 120
    B. Hexagonal layers with bond angles of 120 3-dimensional material with bond angles of 109.5° 2-dimensional material with bond angles of 120°
    C. 2-dimensional material with bond angles of 120 3-dimensional material with bond angles of 109.5 Hexagonal layers with bond angles of 120
    D. 2-dimensional material with bond angles of 120 Hexagonal layers with bond angles of 120 3-dimensional material with bond angles of 109.5

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